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    • PVA TePla America, LLC
    • 251 Corporate Terrace
      Corona, Ca 92879.

    Ion 40Q Plasma System

    IoN 40Q Plasma System

    The Ion 40Q Plasma System is a barrel type plasma reactor. It is designed for batch processing wafers for photoresist strip, descum, nitride etch and other cleaning applications in semiconductor, LED, and MEMS fabrication. The IoN 40Q technology is based on proven reactor designs developed by our company over 40 years (International Plasma Corporation, Branson IPC, Dionex, Gasonics, Metroline, TePla and finally PVA TePla). Today’s IoN 40Q is designed to meet the evolving demands of our customers, emphasizing versatility and control for their surface treatment needs. Its advanced features provide state of the art process control, fail-safe system alarms and data capturing software. This enables the system to meet stringent quality control programs required to manufacture Semiconductor, LED and MEMS devices. The IoN 40Q uses radio frequency (RF) generated plasma in a compact, fully integrated package

    Features include:

    • Low particulate quartz reactor chamber
    • Plug and play self installation
    • Energy saving control feature for lowest cost of ownership
    • Industrial computer with a Windows® based system
    • Graphical User Interface (GUI) software complies to Semi
    • E95-1101 standards
    • Receipe driven processes
    • Sophisticated alarm features and process tolerance controls
    • allowing precise lot-to-lot repeatability
    • Data logging and process statistics monitoring via Ethernet
    • Onboard diagnostic features and alarm logging
    • LCD touch panel and keyboard
    • Optical end point detection
    • Selectable fast or slow venting modes
    • Through-wall mounting with full rear maintenance
    • capability

    Technical Data

    Process Chamber

    Material
    Quartz
    Wafer Size
    All sizes up to 200mm
    Batch Size
    Up to 50, 6” Wafers / load
    Wafer Loading
    Manual

    Process Gas

    • Mass Flow Control Up to 6 gasses
    • Process Pressure Approx. 120-2000 mTorr
    • Evacuation Time ~1 minute (pump dependent)

    RF Generator

    • Air cooled
    • Frequency
    • 13.56 MHz

    Power Output

    • 0-600 watts (standard)
    • 0-1000 watts (optional)

    Power Requirements

    • Electricity 208-240 VAC, 3 phase 30A
    • 50/60 Hz 5-wire (standard)
    • 415-480 VAC, 3 phase 15A
    • 50/60 (optional)
    • Process Gas Input pressure 1-2 bar / 30 PSI
    • Purge Gas Input pressure 1-2 bar / 30 PSI
    • Compressed Air Input pressure 5 bar / 75 PSI

    Chassis

    • Self contained footprint featuring all power and gas connections
    • Easy Roll around chassis with leveling feet

    Dimensions

    • Standard
    • 737 x 1980 x 1118 mm
    • 29” x 78” x 44” (IoN 40Q)
    • Weight
    • 318 kg / 700 lbs. (standard)

    Options

    • 1% pressure monitor
    • Pressure controller
    • Light tower
    • Barcode reader
    • Spectrographic endpoint detection
    • MFC upgrade for corrosive gasses
    • Printer
    • Monomer processing kit
    • Wall mount flange package
    • Vacuum pumps (rotary vane, dry, scroll & blower package)
    • Vapor phase controller
    • Onboard gas generator package option

    Safety Certification Standards

    • CE certified
    • EN 60204
    • EN 61326