The Photoresist Ashing IoN 100-40Q Plasma System is a barrel plasma reactor designed for high volume production applications. The technology is based on the proven reactor designs developed over the course of 50+ years by International Plasma Corporation, Branson ICP, Dionex, Gasonics, Metroline, TePla and finally PVA TePla. IoN 100-40Q uses a larger chassis that provides all the gas and power connections.
Features include:
Plug and play self installation
Industrial computer with LCD touch panel and keyboard. Windows based operating system.
Graphical User Interface (GUI) software complies with CFR Title 21 Part 11 and Semi E95-1101
Multi-level of user access
Software
Recipe editor for fast and versatile step controls
Onboard diagnostic features and alarm logging
Remote process monitoring via Ethernet
Online web based simulation/training/support
Vacuum pump power outlet on the chassis
Energy saving feature for vacuum pump
Typical Applications:
Photoresist ashing and descum
Surface cleaning
Surface activation
IoN 100-40Q Plasma System Technical Data
Process Chamber
Material: Quartz chamber Dimensions: 304 mm D x 508 mm L (12”X20”) Volume: 37 L (1.31 ft3) Chamber Opening: 289.56 mm (11.4”) Electrodes: Clam-shell Number of MFCs: 1 Process Pressure: (0.16 to 2.66) mbar (120 to 2000) mTorr Base Pressure: 0.07 mbar (50 mTorr) Pumping Time: 1 min (Pump dependent) Wafer Sizes: Up to 200 mm (8”) Batch size (Boat): 25 wafers of diameter 200 mm (8”) 50 wafers of diameter 150 mm (6”) Wafer Loading: Manual Plasma Source Frequency/power: 13.56 MHz/600 W
Performance Data
Uptime: 95% MTBF: >500 h MTTR: <2 h
Options
Automated quartz boat loading/unloading
13.56 MHz/1000 W plasma source
Secondary plasma
Faraday/Etch tunnel
Additional MFCs/up to additional five gasses
Endpoint Detection
Single wavelength
Spectrographic
Process pressure control
Light tower with R/Y/G/Buzzer
Barcode scanner; RGA; Printer
Vacuum pumps (Rotary vane, dry)
Onboard gas generators (H2, N2, O2)
Wall mounting package
SECS/GEM interface
Chassis
Large roll around chassis with leveling feet
Self contained footprint featuring all facilities connections including vacuum pump power control
Machine Dimension and Weight
737 mm W x 1067 mm D x 1981 mm H (29”x42”x78”) 318 kg (701 lb) (Varies with options)
Facilities Requirements
Electricity: 208/240 VAC, 3f, 50/60 Hz, 5-wire, 12.8 kW Process Gas Input Pressure: 2 bar (30 psi) Purge Gas Input Pressure: 2 bar (30 psi) Compressed Air Input Pressure: 6 bar (88 psi)
