The GIGAbatch series is the latest and most advanced generation of MW batch ashers offered today and is the successor of the very popular Tepla 300 series. These are used extensively for photoresist ashing, descum, wafer cleaning, and silicon nitride etching. State-of-the-art process control in combination with microwave plasma generation are the key elements of the GIGAbatch family of products. Starting at very economic prices, the systems range from R&D tools to fully-automatic systems for high-volume production in Waferfabs up to 200mm. These Batch Plasma systems are can process all wafer sizes up to 6″for Gigabatch 360 and up to 8″ Gigabatch 380. All models feature the hands-free door opening system for easy loading and unloaded.
Quartz, Diameter 245 mm
Depth 380 mm
MW Frequency 2.45 GHz
max. 1.000 Watt
variable Power
Photoresist Ashing
SU8 Ashing
