Ashing, in which the light–sensitive coating known as photoresist is removed and cleaned from an etched
wafer, is one of the most important and frequently performed steps in chip fabrication. In this step,
photoresist organics are “burned off” using a processing tool in which monatomic plasma is created by
exposing oxygen or fluorine gas at low pressure to high–power radio waves. Previously, wafer ashing was
largely done using batch–processing techniques to achieve the required throughput.
Click Read More to read more on Single-Wafer Ashing of Compound Semiconductors
