Custom Scanning Acoustic Microscope Systems
WINSAM 8 PVA
PVA TePla Analytical Systems proprietary measurement and analysis software.
Visualisation
Dedicated non destructive imaging and analysis of structures inside any bulk specimen 3-D reconstruction
Display of mechanical properties of samples (hardness, density, stress, etc.)
- Time of flight measurement (A-scan)
- Cross-section images (B-scan)
- XY images: C-scan, Dscan, autoscan, multiscan
Automation
- Auto alignment
- Autofocus-system
- Automatic X- Y- Z-scan and storage of all instrument parameters
- Automatic fault recognition
- Remote control
- Fast auto sample detection
- Auto gate and gain control
- Auto signal analysis?
- Auto loader system integration
- SECS interface
- Integration of bar code readers
- High speed robot for wafer up to 12 inch-
Special customized solutions for inline process diagnostic and control:
- Automation Solutions
- Inline inspection from 2 – 12 inch
- Clean room compatibility down to class 10
- Integrated data analysis and automation software, fab
- Communication by SECS interface
- Twin and Quad Scanner for highest throughput
- Arrays of 2 or more transducers for simultaneous image acquisition
- Fast data acquisition by master slave computer configuration, enabling of transducer arrays for maximum throughput
Quantification
- Fault statistics
- Histogram analysis
- Integrated measurement functions
- Film thickness measurement
- Multifunctional image processing
- Non-destructive depth measurement
- Defect maps including result files
