Teflon® ( Polytetrafluoroethylene ), with its very low dielectric constant, is an excellent material to ensure fast signal propagation and superb isolation properties. The defining properties of Teflon®, however, also mean that it is difficult to plate. Prior to electrolysis copper plating the Teflon® surface must first be plasma activated to increase its surface energy so that the copper will adhere. PVA TePla has developed a proprietary gas plasma recipe that provides excellent wettability of Teflon®, and with an activation lifetime much longer than standard plasma processes that use N2 and H2 reactant gases.
