Efficient SU8 Ashing & Sacrificial Layer Removal

Courtesy of SNU, Korea	Courtesy Of University of Texas at Dallas

SU-8 photoresist has many remarkable properties that are ideally suited for use in the fabrication of MEMS and microfluidic devices. SU-8 is a negative-imaging epoxy-type, near-UV photoresist that can be spun with uniform thickness up to 2 mm and its excellent transparency allows processing with standard mask aligners. Among the many merits of this photoresist for MEMS manufacture, is its chemical stability. Unfortunately SU-8 is so stable that its difficult to remove. PVA TePla has successfully developed a plasma process to remove SU-8 by plasma ashing.

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