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Plasma cleaning chip carriers prior to wire bonding

 

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Plasma Cleaning prior to Wire Bonding

In chip packaging, plasma cleaning is essential for improving the cleanliness of bond pads prior to wirebonding. Ball shear and stitch pull strengths are dramatically enhanced by surface plasma cleaning. Ideally, during the pull test the wire should remain welded to the bond pad while it is broken midspan. PVA TePla´s unique microwave plasma efficiently removes organic contaminants and thin oxide layers from the bond pads with unparalleled throughput. Microwave plasma processing allows for tailored surface cleaning and conditioning through the application of our proven and cost effective systems.

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Related Products:
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PS 80 Fully automatic Microwave Plasma Cleaner for individual substrates. Applicable as INLINE SOLUTION or STAND ALONE TOOL.
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Mircowave Plasma System for chip carrier cleaning
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PS 400
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PS 400 H2 Microwave Plasma System 400 Series with hydrogen generator for chip carrier cleaning in magazines.
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