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Atmospheric plasma cleaning of bond fingers

 

Plasma Based Solutions:

Semiconductor wafer
Photoresist Ashing
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MEMS SU8 Ashing
Flat Panel Displays
Pixel Activation
FP Photoresist Ashing
Bond Finger Cleaning
Chip Packaging
Bond Pad Cleaning
Flip Chip Underfill
Encapsulation
Wafer Metrology
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Bond Finger Cleaning

Plasma cleaning can also be applied to the packaging of Flat Panel Displays. For example, LCD or OLED terminal cleaning to remove organic contaminants from the bond fingers prior to connective bonding and conductive film adherence. Also glass activation by plasma prior to chip mounting (COG) is another important application. Because of the need for localized treatment these processes are best performed with PVA TePla’s atmospheric Plasma Pen. Due to the small size of the Plasma Pen nozzle, and the fact that it is attached to an umbilical, it can readily be integrated into a manufacturing line for either in-line or in-situ treatment of substrates.

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The PlasmaPen™ is ideal for inline applications such as the treatment of fibers and spooled wire, or for on-board applications where it can be mounted to dispensing equipment or wirebonders for in-situ surface treatment.
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a Automatic System for single, large-sized glass panels
GIGAfab Gen 2
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Semiconductor wafer boat
 
 
Wafer Cleaning
Chip packager

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