Features and Specifications
Model S4100
* Automatic, single channel, plasma barrel etcher with two process gas inputs.
Reactor Center (PM 11220)
* Quartz chamber (12 in. diameter X 20 in. deep) with hinged access door.
* 3-8 in. wafer compatible
* Optimum load: 50 wafers
* Cover safety interlocks
* Dimensions: 25 in. W X 34 in. D X 17 in. H
Controller (4000 C)
* Single program operation
* Two gas flow rotameters, 0-900 sccm (air)
* Switch-selectable step termination options
* Automatic/manual operation
* Analog wattmeter, forward/reflected scales
* Analog pressure display, 0-20 torr
* Digital elapsed timer, 0-99.9 min.
* ON/OFF vacuum, purge, gas and RF switches with indicator lights
* START, CYCLE, and RESET pushbuttons
* Cover safety interlocks
* Color - coded wiring
* Dimensions: 25 in. W X 24 in. D X 10 in. H
RF Generator (112)
* 0-1000 watts @ 13.56 MHz, continuously variable
• Air cooled tube type amplifier
• 200-220VAC/50/60Hz/1Ph/40 FLA (provides all other system power, except pump)
Installation Requirements
* Dry control air, 60 - 80 psig
* Process gases, 15 psig nominal
* Electrical power: 200-220 VAC, 1%, 40 Amps, 50/60 Hz
