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Printed Circuit Board

 

Plasma Based Solutions:

Printed Circuit Board
Desmear / Etch Back
Carbon Ash
Teflon Activation
Electronic Devices
Potting
Adhesion Promotion
Connectors
Adhesion Promotion
Feedthrough Potting
Anisotropic conductive film
COG
Optical Disk Mastering
Stamper Cleaning
Stamper Conditioning

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Teflon® activation

Teflon® ( Polytetrafluoroethylene ) , with its very low dielectric constant, is an excellent material to ensure fast signal propagation and superb isolation properties. The defining properties of Teflon®, however, also mean that it is difficult to plate. Prior to electroless copper plating the Teflon® surface must first be plasma activated to increase its surface energy so that the copper will adhere. PVA TePla has developed a proprietary gas plasma recipe that provides excellent wettability of Teflon®, and with an activation lifetime much longer than standard plasma processes that use N2 and H2 reactant gases.

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Related Products:
IoN 40
IoN 100
Plasma Pen
Robo Pen
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To Request Application Literature or Further Information, Click Here

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Plasma Treatment for Electronics
 
 

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