Scanning Acoustic Microscopy Systems
Acoustic Microscope
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Applications for Semiconductor Industry

Chip inspection: Die top, lead frame area IGBT with pin finThroughscan
Delamination Detection
Throughput and automation matters for production
control. Hence software automatically detects mold
to leadframe delamination. 4.65% delaminated area is
displayed in red.
Die inspection, delamination and crack investigations
IC with relative warpage in mm Shrink small outline package
Transducer 30 MHz


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