Remote Microwave Plasma System Silicon Star 12 OEM

The Silicon Star 12 OEM is a remote cold plasma system based on microwave generation. This OEM machine is ideally suited for many different applications like stress relief, special surface treatments and wafer thinning. In this plasma system the dry etching effect is based on pure chemical reaction of reactive plasma particles (radicals) guided through the chamber downstream configuration.

The Silicon Star 12 OEM system is easy to operate. The process does not require any additional substrate cleaning. The surface treatment is performed strictly by pure radical species. The electron-free and ion-free processing is the key factor for the successful treatment of extreme sensitive silicon substrates like NAND and DRAM. The plasma is generated by a 2.45 GHz Magnetron located about 60 cm above the wafer on top of the process chamber. The system is compatible with 6” to 12” wafer sizes.

This Tool has a very compact design to keep the footprint as low as possible and to allow easy combination with existing wafer thinning lines

To Request a Brochure/Literature/Product CD, Click Here