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| Silicon Star 12 |
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Technical Specifications: Plasma Chamber: Anodized Aluminum, Diameter 460 mm, Volume 80 liters Plasma Generation: MW Frequency 2.45 GHz, max. 2000 Watt, variable power System Dimension: Weight: approx. 1600 kg Options:
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The “Silicon Star 12” is a fully automated Remote Plasma System equipped with a Bernoulli Handling for loading and unloading 8” and 12” Wafers down to 50µm. As a standard the system is provided with a FOUP Loadport. With an etch rate of up to 3 µm/min we achieve an excellent uniformity with a throughput up to 20 w / h (depending on process requirements).
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