PVA TePla AG specializes in advanced Microwave Plasma Processing systems for silicon and compound semiconductors (i.e. power devices, HB-LED, MEMS, PLED, and Solar Cell manufacturing). Front-End solutions include batch and single wafer systems for photoresist ashing and descum, as well as removal of polymers, SU8 Removal and sacrificial layers for MEMS fabrication. Back-End / Advanced Chip Packaging applications include plasma wafer cleaning and surface activation prior to wirebond and encapsulation for Flip Chip, stacked dies, MCM and advanced Cu lead frames. Pre-Assembly solutions include Wafer Stress Relief, Background Stress Relief, Chip Side Healing (CSH) and passivation for ultra-thin wafer technologies down to 25µm thickness. Our wafer metrology tools offer unique stress/defect analysis (SIRD) and ion implantation monitoring (TWIN) for quality inspection on 300mm wafers in high volume manufacturing.
