Plasma applications in Integrated circuit manufacturing
PVA TePla AG specializes in advanced Plasma Systems for cleaning applications during fabrication of micro devices such as; power devices, HB-LED, MEMS, PLED, and photovoltaics. Front-End solutions include batch and single wafer systems for photoresist ashing and descum, as well as removal of polymers, SU-8 removal and sacrificial layers for MEMS fabrication.
Advanced Chip Packaging plasma applications include plasma wafer cleaning for wafer level packaging, chip carrier plasma cleaning prior to wire bonding, encapsulation and Flip Chip underfill.
Plasma wafer processing also includes pre-Assembly solutions such as Wafer Stress Relief, Chip Side Healing (CSH) and passivation for ultra-thin wafer technologies down to 25µm thickness.
Our wafer metrology tools offer unique stress/defect analysis (SIRD) and ion implantation monitoring (TWIN) for quality inspection on 300mm wafers in high volume manufacturing.