Wafer Surface Treatment with plasma
     
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Plasma Passivation post CMP

 

Plasma Based Solutions:

Semiconductor wafer
Photoresist Ashing
Solar Cells
Solar Cell Etching
MEMS
MEMS SU8 Ashing
Flat Panel Displays
Pixel Activation
FP Photoresist Ashing
Bond Finger Cleaning
Chip Packaging
Bond Pad Cleaning
Flip Chip Underfill
Encapsulation
Wafer Metrology
Stress Imaging
Implant Dosage
Failure Analysis
Decapsulation

Surface Passivation

There are three important reasons to consider suface passivation.

1. In an in-line wafer thinning cluster tool, the time between grinding and mounting is too short for the free dangling silicon bonds to capture oxygen from the air. Once the free silicon bonds are in contact with the dicing tape, the glue reacts chemically with the tape and the die sticking force increases with time. The oxide passivation by remote plasma treatment effectively prevents these kinds of adhesion issues in thin wafer production.

2. The second reason customers apply our “Remote Plasma based Passivation” is because of the potential capture of metal ions. Oxide passivation, nitriding or other tailored surface treatment can contribute to yield improvement for electrically sensitive products like NAND and DRAMs.

3. The third benefit of applying the passivation is the surface energy change from hydrophobic to hydrophilic. A hydrophilic surface is easy to clean and the risk of mold pop-up effects due to remaining particles on the chip backside is reduced.

To Request Application Literature or Further Information, Click Here

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What is plasma?
Plasma Technology
 
Why Microwave?
Microwave Plasma Technology
 
Why
Ultra Thin Wafers?
 
Wafer Thinning Semiconductor Application
 
  Why Stress Relief?
Semiconductor Application Stress Relief
 
 

Why
Plasma Treatment?

 
Plasma Treatment Systems

 

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