Photoresist Removal & Plasma Ashing
     
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Plasma cleaning wafers

 

Plasma Based Solutions:

Semiconductor wafer
Photoresist Ashing
Solar Cells
Solar Cell Etching
MEMS
MEMS SU8 Ashing
Flat Panel Displays
Pixel Activation
FP Photoresist Ashing
Bond Finger Cleaning
Chip Packaging
Bond Pad Cleaning
Flip Chip Underfill
Encapsulation
Wafer Metrology
Stress Imaging
Implant Dosage
Failure Analysis
Decapsulation

 Plasma Photoresist Ashing

Photoresist ashing

Plasma photoresist ashing following etching and ion implantation is one of the most important and frequently performed steps in semiconductor fabrication. The number of lithography cycles can vary typically from 10 to 25. Each cycle requires a photoresist stripping process. Plasma photoresist stripping of the photo-mask is a dry, eco-friendly process called Plasma Ashing, and is fast replacing wet stripping / wet etching technologies. PVA TePla is the market leader for Plasma Ashing systems using either microwave or RF excitation. We offer both Single Wafer and Batch Ashers. 
Microwave plasma is ideal for most resist removal in modern device fabrication, since it produces a very high concentration of chemically active species along with low ion bombardment energy, guaranteeing fast ash rate and a damage-free plasma cleaning. Microwave plasma systems are suitable for various substrate technologies like Si, III/V-compounds, quartz, ceramic, lithium niobate, copper interconnect devices etc. The inherently isotropic plasma etch characteristic is an advantage for sacrificial layer etch and SU-8 removal in MEMS fabrication.
Typical device markets served are:

  • Mixed signal devices, CMOS, Bipolar
  • Power Devices
  • High Brightness LEDs
  • MEMS, SAW-Devices
  • Flat Panel Displays (PLEDs)
  • III/V-compound materials
  • SiC-wafers
  • Nano Imprint Lithography, stamper clean

To Request Application Literature or Further Information, Click Here 

Related Products:
1
Plasma asher - GIGA Batch Series

This series of resist batch ashers ranges from manual to fully automated accommodating wafers from 2" to 8" (50 to 200 mm)

GIGAbatch series
b
Plasma Asher - GIGAfab A200/300 Fully automatic single wafer resist
stripping system for implant resist
and MEMS applications for wafers
up to 300 mm
GIGAfab A200/300
b
Plasma Asher - GIGfab M
Plasma system with large area planar source technology for low temperature ashing of SU-8 and other sensitive organic layers. Used in MEMS fabrication and OLED/PLED development. Holds one 300 mm wafer or four 150 mm wafers
GIGAfab M
c
Plasma Asher - IoN 10 Laboratory or university microwave system ideal for resist ashing, wafer cleaning and decapsulation of electronic devices
IoN 10
a
 

 

 

Semiconductor wafer boat
 
 
Wafer Cleaning
Chip packager

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