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Semiconductor Wafers  

Plasma Based Solutions:

Semiconductor wafer
Photoresist Ashing
Ultra Thin Wafer
Wafer Stress Relief
Chip Side Stress Relief
Post CMP Treatment
Wafer Thinning
Surface Passivation
Solar Cells
Solar Cell Etching
MEMS
MEMS SU8 Ashing
Flat Panel Displays
Pixel Activation
FP Photoresist Ashing
Bond Finger Cleaning
Chip Packaging
Bond Pad Cleaning
Flip Chip Underfill
Encapsulation
Wafer Metrology
Stress Imaging
Implant Dosage
Failure Analysis
Decapsulation

 Plasma Photoresist Ashing

The removal of photoresist masks after processes such as etching and ion implantation, is one of the most important and frequently performed steps in front-end semiconductor manufacturing. Depending on the complexity of the devices concerned, the number of lithography cycles can vary typically from 10 to 25. Each cycle requires a photoresist removal process. The process of plasma photoresist stripping of the mask is a dry, eco-friendly process called Plasma Ashing, and is fast replacing wet stripping / wet etching technologies. PVA TePla is the market leader for Plasma Ashing equipment using either microwave or RF excitation. We offer both Single Wafer and Batch Ashers.  Microwave plasma is ideal for most resist removal in modern device fabrication, since it produces a very high concentration of chemically active species along with low ion bombardment energy, guaranteeing fast ash rate and a damage-free plasma processing. Microwave plasma systems are suitable for various substrate technologies like Si, III/V-compounds, quartz, ceramic, lithium niobate, copper interconnect devices etc. The inherently isotropic etch characteristic is an advantage for sacrificial layer etch and SU-8 removal in MEMS fabrication.

Typical device markets served are:

  • Mixed signal devices, CMOS, Bipolar
  • Power Devices
  • High Brightness LEDs
  • MEMS, SAW-Devices
  • Flat Panel Displays (PLEDs)
  • III/V-compound materials
  • SiC-wafers
  • Nano Imprint Lithography, stamper clean

To Request Application Literature or Further Information, Click Here 

Related Products:
1
a

This series of resist batch ashers ranges from manual to fully automated accommodating wafers from 2" to 8" (50 to 200 mm)

GIGAbatch series
b
a Fully automatic single wafer resist
stripping system for implant resist
and MEMS applications for wafers
up to 300 mm
GIGAfab A200/300
b
PS 4008
Plasma system with large area planar source technology for low temperature ashing of SU-8 and other sensitive organic layers. Used in MEMS fabrication and OLED/PLED development. Holds one 300 mm wafer or four 150 mm wafers
GIGAfab M
c
M4L Laboratory or university microwave system ideal for resist ashing, wafer cleaning and decapsulation of electronic devices
IoN 10
a
 

 

 

 
 

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