Implant Dosage | Plasma Application | PVA TePla America, Inc. | 800-527-5667
   
english | deutsch
  Home Applications Semiconductor  
   
Wafer Metrology  

Plasma Based Solutions:

Semiconductor wafer
Photoresist Ashing
Ultra Thin Wafer
Wafer Stress Relief
Chip Side Stress Relief
Post CMP Treatment
Wafer Thinning
Surface Passivation
Solar Cells
Solar Cell Etching
MEMS
MEMS SU8 Ashing
Flat Panel Displays
Pixel Activation
FP Photoresist Ashing
Bond Finger Cleaning
Chip Packaging
Bond Pad Cleaning
Flip Chip Underfill
Encapsulation
Wafer Metrology
Stress Imaging
Implant Dosage
Failure Analysis
Decapsulation

Monitoring of Implant Dose on up to 300mm Wafers

The Implant process is a very critical step within the integrated circuits manufacturing line. It defines important characteristics and properties of the devices-to-be by doping certain layers of the silicon substrate. Rework processes are very difficult and often impossible to apply. Therefore, the constant quality monitoring of the implant process is inevitable in order to maintain device yield. The result of the implant process can be measured and qualified on product wafers. The TWIN’s measurement range covers 10E10 to 5E16 dose levels at the implant energy level 1keV to 100 MeV.

Click Here For Application Reports and Information

To Request Application Literature or Further Information, Click Here

Related Products:
d
Dose evaluation by means of Thermal Wave excitation and reflectivity measurement on monitor and product wafers, double -and triple- implant evaluation with supreme resolution. Measurement controlled by pattern recognition, rectangular or polar mapping.
TWIN
c
 

 

 

 
 

© 2010 PVA TePla America. All rights reserved.