Flip Chip Underfill | Plasma Activation | Eliminate Voids
     
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Plasma treatment of flip chips

 

Plasma Based Solutions:

Semiconductor wafer
Photoresist Ashing
Solar Cells
Solar Cell Etching
MEMS
MEMS SU8 Ashing
Flat Panel Displays
Pixel Activation
FP Photoresist Ashing
Bond Finger Cleaning
Chip Packaging
Bond Pad Cleaning
Flip Chip Underfill
Encapsulation
Wafer Metrology
Stress Imaging
Implant Dosage
Failure Analysis
Decapsulation

 Plasma Cleaning prior to Flip Chip Underfill

Plasma cleaning in FlipChip packaging technology has become a must for yield improvement. Advanced Flip Chip devices are gaining in market prominence, and microwave plasma processes are unrivalled at penetrating the minute gaps beneath the dies. All surfaces, regardless of the volume under the die are perfectly activated and conditioned. PVA TePla’s microwave plasma consistently performs, providing void-free FlipChip underfill, optimum adhesion and a dramatically enhanced wicking speeds. Application suitability goes well beyond die sizes of 20x20mm and 50µm bumps.

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Related Products:
e
PS 80 Fully automatic Microwave Plasma Cleaner for individual substrates. Applicable as INLINE SOLUTION or STAND ALONE TOOL.
GIGA 80 Plus
e
a
Mircowave Plasma System for chip carrier cleaning
GIGA 690
d
PS 400
Microwave Plasma System 400 Series for chip carrier cleaning in magazines
PS 400
c
PS 400
Microwave Plasma System 400 Series for chip carrier cleaning in magazines
PS 400 IL
a
PS 400 H2 Microwave Plasma System 400 Series with hydrogen generator for chip carrier cleaning in magazines.
PS 400 H2
a

 

 

Semiconductor wafer boat
 
 
Wafer Cleaning
Chip packager

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