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Plasma activation of chip carriers prior to overmold

 

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Plasma Cleaning and Activation prior to Encapsulation

In semiconductor micro-chip packaging, microwave plasma cleaning and activation is used in applications of adhesion promotion of encapsulant mold compounds. This includes “glob top” and “flip chip underfill” processes. The highly reactive microwave plasma uses the chemical power of oxygen radicals to modify various substrate surfaces: solder mask materials, die passivation layers, bond pads as well as leadframe surfaces. Mold delamination problems are thus eliminated, and by using PVA TePla’s microwave plasma there is no risk of ESD or other potentially harmful side effects.

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Related Products:
e
PS 80 Fully automatic Microwave Plasma Cleaner for individual substrates. Applicable as INLINE SOLUTION or STAND ALONE TOOL.
GIGA 80 Plus
e
a
Mircowave Plasma System for chip carrier cleaning
GIGA 690
d
PS 400
Microwave Plasma System 400 Series for chip carrier cleaning in magazines
PS 400
c
PS 400
Microwave Plasma System 400 Series for chip carrier cleaning in magazines
PS 400 IL
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PS 400 H2 Microwave Plasma System 400 Series with hydrogen generator for chip carrier cleaning in magazines.
PS 400 H2
a

 

 

Semiconductor wafer boat
 
 
Wafer Cleaning
Chip packager

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