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GIGA 80 PLUS ASYNTIS

Technical Specifications:

 20 w/h @ 12 for Chip Side Healing
 (10 m removal from each chip side)

Substrates:
up 12 Dicing taped Wafer Frames

 

Related Applications:

  • Stress Relief
  • Chip Side Stress Relief
  • Post CMP Treat Ment
  • Wafer Thinning
  • Passivation
  •  

    Fully Automated Remote Plasma System with automatic substrate loading and unloading
       

     

    APPLICATIONS:

    •Chip Side Healing
    •Back-Side Stress Relief (AES Process, active side faces dicing tape)
    •Contact free exposing 3D-TSV (AES Process, active side faces dicing tape)
    •Wafer and Die Thinning (AES Process, active side faces dicing tape)
    •Dry and Damage free Wafer Dicing (AES Process, active side faces dicing tape)
    •Single Die Etching (active side faces dicing tape)
    •Surface Passivation

     

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