The Plasma System 80 PLUS is the only fully automatic low-pressure Microwave Plasma System worldwide focused on the cleaning of individual substrates to improve die attaching, wire bonding, mold adhesion, FlipChip underfilling and ball attaching. The PS 80 PLUS is applicable as INLINE SOLUTION or as STAND ALONE TOOL for strip handling from magazine buffers.

Featuring our unique microwave plasma technology, the PS 80 PLUS delivers the shortest possible processing times and damage-free substrate cleaning. This is combined with unsurpassed uniformity and efficiency of plasma treatment.

The Plasma System 80 PLUS can accommodate any type of chip carrier and meets all requirements of today’s chip packaging applications. Converting the substrate transportation system is user-friendly and easy.

A highlight of the PS 80 PLUS is the superb jam detection system allowing processing of wire-bonded substrates and leadframes.

This includes the thinnest BT substrates or the most flimsy Cu leadframes. The Microwave Plasma System 80 PLUS also offers a compact footprint and is presented with an intuitive user interface.

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