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PLASMA SYSTEM 80 PLUS

Technical Specifications:

Plasma Chamber:
 Aluminum
 Inner Dimension 330 x 370 mm

Plasma Generation:

Microwave
 MW Frequency 2.45 GHz
 max. 1000 Watt
 variable power

RF

13.56 MHz max: 1000 watt
variable power

Options:
  Additional gas channels 3-4
  Vacuum pump system

Related Applications:

  • Flip Chip Underfill
  • Bond Pad Cleaning
  • Encapsulation
  • Strip System
  • Strip type plasma prior die attach, wire bonding, Flip Chip underfill and encapsulation. Plasma Sysetm 80 Plus Double Loader
    Inline PS 80 plus system Plasma system 80 loader

    PLASMA SYSTEM 80 PLUS

    The plasma system 80 Plus is easy to operate and features same side loading and unloading, in manual and automatic mode. The System software complies to the standards in the semiconductor industry. Due to the very short process time the system can be integrated into fully automated assembly lines.

    The 80 Plus is available in two configurations:

    Configuration "IoN":

    RF of 13.56 MHz is applied via electrode into the vacuum chamber to allow physical surface treatment via ion bombardment.

    or:

    Configuration "GIGA":

    Microwave of 2,45 GHz is applied on top of the vacuum chamber producing a largely extended plasma producing free radicals. Due to the use of microwaves the 80 Plus GIGA delivers fast, low temperature and damage free chemical surface treatment.

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