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Metrology Products  

Plasma Based Solutions:

Wafermetrology
SIRD
TWIN
Ultrasonic Measurement
Ultra Sonic Microscopy

 

Our Wafer Metrology equipment offer unique stress/defect analysis and ion implantation monitoring for quality inspection of 300 mm wafers for high volume manufacturers.

PVA TePla also offers a wide range of ultra sonic microscopy application systems for the inspection of high tech materials.

 
 
 

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