Failure Analysis, Metrology Systems, Scanning Acoustic Microscope
     
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Failure Analysis for Wafers

 

Plasma Based Solutions:

Ultrasonic Measurement
Acoustic Microscopy
Wafermetrology
SIRD
TWIN

 

FAILURE ANALYSIS

Metrology Group

Our Wafer Metrology equipment offer unique stress/defect analysis and ion implantation monitoring for quality inspection of 300 mm wafers for high volume manufacturers.
Scanning Acoustic Microscopy
Scanning Acoustic Microscopy (SAM)

Our Scanning Acoustic Microscopes are used for defect detection, quality control and nondestructive failure analysis of bonded wafers and packaged electronics. We specialize in high throughput production environments and fully automated handling systems. CLICK HERE FOR MORE INFO

Autowafer 300 SAM
Scanning Acoustic Microscopy
Scanning Infrared Depolarization (SIRD) Measurement
The SIRD is a stress measurement system at wafer level for process monitoring, which will contribute to cost reduction as well as yield improvement. CLICK HERE FOR MORE INFO
METROLOGY SYSTEM SIRD A300 P
Scanning Acoustic Microscopy
Twin Metrology System
The Implant process is a very critical step within the integrated circuits manufacturing line. It defines important characteristics and properties of the devices-to-be by doping certain layers of the silicon substrate. CLICK HERE FOR MORE INFO
TWIN Metrology System
Scanning Acoustic Microscopy
OTHER ADVANTANGES OF OUR FAILURE ANALYSIS TOOLS (SAM)

– Nondestructive and fast examination of volume and structural defects in different materials.

– Displaying of nonhomogeneities, density differences, tensions, delaminations

– Layer-thickness measurement, reliability examination, judgment of material connections

– The confocal properties can be exploited to give enhanced depth resolution to examine individual interfaces

 
Semiconductor wafer boat
 
 
Wafer Cleaning
Chip packager

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