The 9200 is a RF isotropic batch plasma etching/ashing system. Available with optional high temperature capabilities for photoresist removal, nitride etch, and other cleaning applications in semiconductor and MEMS fabs.
The 9200 offers:
- Traditional quartz barrel design
- 100, 150, & 200 mm wafer capability
- Patented etch tunnel minimizes charge damage
- Reliable operation
- Through-wall mounting
- Optical end point detection
- Windows® based color touch screen interface
- Easy maintenance
This system, much like our 7200 series, offers impressive features and
capabilities with particular emphasis on reliability and safety. It is based on
proven reactor designs developed over the past 25 years. Hundreds of these
systems are in use in wafer processing applications throughout the world.
The IoN 40Q has replace this system. Please call customer service about this system.
Did you know that PVA TePla may be able to perform maintenance, repair, or provide parts to this system? Please contact our customer service department for further information.
800-527-5667 M-F 8am - 5pm Pacific Time.