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IoN Tumbler Gas Plasma System

Technical Data

Process Chamber
Materials
Material Aluminum (A)
Chamber Volume & Inner Dimensions
IoN 100T
100 liters, 14.76” x 14.76” x 28” L
(375 x 375 x 711.20 mm L)
IoN 140T
140 liters, 14.76” x 14.76” x 38” L
(375 x 375 x 965 mm L)
IoN 190T
190 liters, 20” x 20” x 35” L
(508 x 508 x 863.60 mm L)

Process Gas
Mass Flow Control
up to 6 gasses
Process Pressure
Approx. 120-2000 mTorr
Evacuation Time ~1 minute (pump dependent)
RF Generator
Air cooled
Frequency
13.56 MHz
Power Output
600 or 1000 watts (standard)
0-1250 watts air cooled (optional)

Power Requirements
Electricity
208-240 VAC, 3 phase 30A
50/60 Hz 5-wire (standard)
415-480 VAC, 3 phase 15A
50/60 (optional)
Process Gas
Input pressure 1-2 bar / 30 PSI
Purge Gas Input pressure 1-2 bar / 30 PSI
Compressed Air Input pressure 5 bar / 75 PSI
Chassis
Self contained footprint featuring all power and gas
connections
Roll around chassis with leveling feet
Dimensions
Standard
635 x 1120 x 1473 mm
29” x 78” x 58” (IoN 140)
135 liters - A
Weight
350.45 kg / 771 lbs. (standard)
Options

  • 1% pressure monitor
  • Recirculating liquid chiller
  • Pressure controller
  • Light tower
  • Barcode reader
  • Spectrographic endpoint detection
  • MFC upgrade for corrosive gasses
  • Printer
  • Monomer processing kit
  • H2 generator unit
  • Wall mount package
  • Vacuum pumps (rotary vane, dry, scroll and
  • blower package)
  • Vapor phase MFC

Safety Certification Standards

  • CE certified
  • EN 60204
  • EN 61326

IoN Tumbler Plasma System

The IoN Tumbler is one of our latest advancements in vacuum plasma technology. Gas plasma is fast becoming the technology of choice for surface modification of materials in the life sciences, electronic and industrial arenas due to its versatility and low impact to our environment. For example, the trend towards miniaturization in medical diagnostics requires precision cleaning, and selective chemical functionalization. Plasma removes organic contamination several orders of magnitude more efficiently than wet chemical processing and can chemically functionalize surfaces at the nano-scale. As a result, plasma is replacing older types of treatments that are no longer practical or economical. The IoN Tumbler is designed to meet the evolving demands of our customers, emphasizing versatility and control for their surface treatment needs. Its advanced features provide state of the art process control, fail-safe system alarms and data capturing software. This enables the system to meet stringent quality control programs in the Life Science industries. The IoN Tumbler uses radio frequency (RF) generated plasma in a compact, fully integrated package. Another design feature of the new IoN Tumbler is the ability to quickly and easily alternate between different chamber sizes and part basket configurations.

Features include:

  • Flexible quick change electrode and chamber options
  • Plug and Play self installation
  • Onboard gas generator package option
  • Energy saving control feature for lowest cost of ownership
  • Configurable chamber that can accommodate various electrode configurations for small sized complex 3- dimensional parts or high volume large part processing
  • PLC or Industrial computer with a Windows® based system
  • Graphical User Interface (GUI) software complies with CFR Title 21 Part 11 and Semi E95-1101
  • User access control for separate process development, operator and maintenance programming and control
  • Configurable process tolerance controls allowing precise lotto- lot repeatability
  • Remote statistical process control monitoring via Ethernet
  • Onboard diagnostic features and alarm logging
  • Recipe editor offers fast and versatile step control functionality
  • Liquid Crystal Display (LCD) touch panel and keyboard if PC option is chosen
  • Tumbler basket can be configured for powders and parts


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