IoN 10 Plasma System | PVATePla America, Inc.

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Details

Ion Wave 10 Gas Plasma System

Technical Data

Process Chamber
Materials Quartz or Ceramic Barrel
Dimensions 245mm Dia. x 240 mm length

(9.64”ø x 9.45”L)

Volume 11.3 liters (0.4 ft3)
Process Gas Control Up to 8 gases, MFC

controlled

Base Pressure               0.07 mbar (50 mTorr)
Process Pressure           0.5 – 1.5 mbar
(375 – 1125 mTorr)
Evacuation Time           ~1 minute

Microwave Generator
Frequency 2.45 GHz
Power Output 0-600W

Power Requirements
Electricity                     230V, 50/60 Hz, 10A, single phase
Process Gas                  1-2 Bar (15-30 psi)
Compressed Air            4-6 Bar, capable of delivering 56 Lpm (intermittent), (60-90 psi)
Purge Gas                     1.3-2.7 Bar, capable of delivering 28 l/m (intermittent), (20-40 psi)
Dimensions W/H/D       755 x 723 x 781 mm
(30.5” x 28.5” x 30.75”)

Weight 134 kg / 294 lbs.

Options

Input power step-up transformer 115-230 VAC
Temperature controlled plate
1% Pressure Monitor
Pressure controller
Light tower
Barcode reader
Alternate gas selector
Spectrographic endpoint detection
Faraday Cage (secondary plasma)
Ceramic chamber, chemical resistant seals
Table
Printer
Vacuum pump options:

            12 cfm (20 m3/h)
            18 cfm (31 m3/h)
            28 cfm (48 m3/h)

Dry and Scroll pumps available

Safety Certification Standards
Independently laboratory tested

CE certified
EN 61010
EN 61326

The IoN Wave 10 plasma system is our latest advancement in microwave plasma possessing. This low cost, mid-sized wafer batch asher is designed with advanced features and targets the needs of small scale foundries, universities and start-up companies.

The IoN Wave 10 is equipped with new, state of the art components and software to precisely control processing parameters. Its process monitoring and data capturing software allows for the most stringent quality controls available. This technology has been successfully used for power transistors, analog devices, sensors, optical devices, photonics, MEMS/MOEMS, bio devices, etc.

The small footprint of the IoN Wave 10 requires minimal laboratory space and provides for simple installation and maintenance. Using microwave plasma technology, this system produces high photoresist ashing rates with minimal exposure to electro static discharge (ESD).

Features Include:

Small foot print tabletop design
A quartz chamber accommodating 2”– 8” wafers
and quartz boats carrying up to (25), 6” inch wafers
Industrial computer with a Windows® based system
Graphical User Interface (GUI) software complies with Semi E95-1101
User access control for separate process development,
operator and maintenance programming and control
Configurable process tolerance controls allowing precise lot-to-lot repeatability
Remote statistical process control monitoring via Ethernet
Onboard diagnostic features and alarm logging
Recipe editor offers fast and versatile step control functionality
10.4” Liquid Crystal Display (LCD) touch panel and keyboard
Recipe editor simulator software
Online Web based simulation, training and support program
Plug and play installation

Typical applications:

Photo-resist stripping
Wafer descum
Wafer cleaning prior to wet etching
SU-8 removal
Etching of passivation layers
Device decapsulation for failure analysis
Cleaning and surface activation
Low temperature ashing of materials for chemical trace analysis
Cleaning of filters and membranes

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