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Teflon Activation
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Plasma Based Solutions:
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Teflon® activation
Teflon® ( Polytetrafluoroethylene ) , with its very low dielectric constant, is an excellent material to ensure fast signal propagation and superb isolation properties. The defining properties of Teflon®, however, also mean that it is difficult to plate. Prior to electroless copper plating the Teflon® surface must first be plasma activated to increase its surface energy so that the copper will adhere. PVA TePla has developed a proprietary gas plasma recipe that provides excellent wettability of Teflon®, and with an activation lifetime much longer than standard plasma processes that use N2 and H2 reactant gases.
Related Products:
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4031 / 4061 / 4081 |
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The plasma systems series 4031, 4061 and 4081 are high-capacity production tools for use in printed circuit board manufacturing. |
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To Request Application Literature or Further Information, Click Here |
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What is Plasma? |
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RF Plasma? |
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Atmospheric Plasma? |
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