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Potting
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Plasma Based Solutions:
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Improve adhesion of potting compounds.
 Plasma activation prior to potting ensures a good hermetic seal, reduces current leakage and provides stronger physical bonding to the device. The protection of electronic or electrical devices by an encapsulating resin is referred to as “potting”. Potting provides electrical insulation and protection from moisture, high/low temperatures, and physical and electrical stress. It can also function as a flame retardant, shock absorber and heat sink. Poor “wetting” of the potting material to the device is common, particularly to low surface energy polymers. This can result in poor bonding and voiding. Plasma activation raises surface energies and ensures good wettability, and more complete flow of resins onto almost all low energy polymer materials, including PTFE, silicone rubber and Kapton®.
Related Products:
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M4L |
Plasma Pen |
7200 |
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To Request Application Literature or Further Information, Click Here |
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What is Plasma? |
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Why
RF Plasma? |
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Why
Atmospheric Plasma? |
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