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Carbon Removal
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Plasma Based Solutions:
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Carbon removal
 Metallization of through-vias is often impeded by carbonaceous deposits formed during laser drilling. To remove these deposits from vias, the printed circuit boards are immersed into gas plasma. The chemically energetic plasma safely cleans the carbon from the vias, in preparation for the metallization process. The carbon is converted into volatile reaction products that are completely removed from the plasma chamber by the vacuum pump.
Related Products:
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4031 / 4061 / 4081 |
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The plasma systems series 4031, 4061 and 4081 are high-capacity production tools for use in printed circuit board manufacturing. |
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To Request Application Literature or Further Information, Click Here |
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What is Plasma? |
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Why
RF Plasma? |
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Why
Atmospheric Plasma? |
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