Plasma Treatment for Electronics (PCB)
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Carbon Ash Removal on Printed Circuit Boards


Plasma Based Solutions:

Printed Circuit Board
Desmear / Etch Back
Carbon Ash
Teflon Activation
Electronic Devices
Adhesion Promotion
Adhesion Promotion
Feedthrough Potting
Anisotropic conductive film
Optical Disk Mastering
Stamper Cleaning
Stamper Conditioning


Carbon Ash

Metallization of through-vias is often impeded by carbonaceous deposits formed during laser drilling. To remove these deposits from vias, the printed circuit boards are immersed into gas plasma. The chemically energetic plasma safely cleans the carbon from the vias, in preparation for the metallization process. The carbon is converted into volatile reaction products that are completely removed from the plasma chamber by the vacuum pump.


Related Products:
IoN 40
IoN 100
Plasma Pen
Robo Pen
Plasma Treatment System Ion 40 Plasma Treatment System IoN 100 Atmospheric Plasma Treatment System Plasma Pen Plasma Treatment System Robo Pen
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Plasma Treatment for Electronics

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