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Plasma Surface Treatments for Electronic Devices


Plasma Based Solutions:

Printed Circuit Board
Desmear / Etch Back
Carbon Ash
Teflon Activation
Electronic Devices
Adhesion Promotion
Adhesion Promotion
Feedthrough Potting
Anisotropic conductive film
Optical Disk Mastering
Stamper Cleaning
Stamper Conditioning


Adhesion promotion

Improve adhesive bond properties of materials.
Plasma is ideal for treating plastics, metals, ceramics, and glass prior to adhesive bonding. In each case, loose boundary films are removed and truly hyper-clean surfaces remain.
For plastics, there is an additional advantage in that a few hundred angstroms of the bulk material can be removed after the loose boundary film is stripped. This final surface is roughened on an atomic scale, providing more surface binding sites for optimal adhesion.
Also, the surface is altered chemically by the reactive atoms present in the plasma. New chemical functional groups are formed with strong chemical bonds to the bulk of the material. These extra polar bonds help both water and adhesives wet into every crevice of the material. The net effect is a tremendous improvement in bonding. In some cases, up to a 50X bond strength improvement is observed.
It is also possible to alter the surface chemistry of a polymer to bond with a particular adhesive of choice. Gases other than oxygen can be used to create the type of surface needed. This greatly broadens the options for material engineers in product design.


Related Products:
IoN 40
IoN 100
Plasma Pen
Robo Pen
Plasma Surface Treatment System IoN 40 Plasma Surface Treatment System IoN 100 Plasma Surface Treatment System Plasma Pen Plasma Surface Treatment System Robo Pen
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Plasma Treatment for Electronics

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