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Custom System
  • Optional Controller: Windows® O/S based touch screen interface offering fully automatic control.

  • Multi-step recipes, real time graphic display, multi-level password access, data logging, and real time SPC monitoring of all plasma parameters is provided.

  • Chamber: up to 20" X 16 " X 40 " standard custom systems inner dimensions aluminum, with high-conductance KF 40 port and isolation valve.

  • Electrode options include 3-shelf, 5-shelf, 7-shelf, and cage electrodes.

  • RF Generator: up to 1000 watt 13.56 MHz air cooled with automatic impedance matching network air cooled with automatic impedance matching network.

  • Display: Color 10.4 inch touch screen for control and monitoring of process parameters, automatic recipes, or manual plasma treatments.

  • Two user specified gases, with 500 sccm MFCs standard, Optional 3rd gas channel available.

  • Power Requirements: 120- 240 volts, 1ø, 50/60 Hz 30 amps maximum, changeable in the field.

  • CE Certified


Safety and Security

  • Electronic and software interlocks

  • · RF power
    · Pressure
    · Chamber door open/close

  • Emergency OFF push button..

  • Password security for manual and edit modes.

  • Audible alarms.

  • Alarm limits on critical process parameters.

  • Over-temperature alarm sensor (generator).

  • Hard-wired RF relay interlocked with process chamber door.

  • External interlock connection to extend control loop.

PVA TePla America's strong quality program and organizational strength allow us to design Custom Systems at minimum cost to the customer. In today's market where plasma is being used in a broad spectrum of industries, for a wide a variety of applications, there is often a need for customization. At PVA TePla America we have endeavored to keep the cost of custom equipment low and our lead times short by accommodating the possibility of retrofits into our designs. For example our chambers can be fitted with electrode configurations where parts can be treated on trays or tumbled in a rotary basket.

Advantages:

  • Plasma surface modification
  • Plasma cleaning of organic surfaces
  • Bond strength enhancement
  • Plasma etch applications
  • Plasma asher applications
  • Increased or decreased wettability
  • Any other plasma system application

The Custom System can be controlled as a separate chamber, control, generator, and pump or as one in an enclosure.


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