Scanning Acoustic Microscopy Systems
     
  «Back To Products Inquire Here  

 

Scanning Modes

SAM is a non-destructive technique used to investigate samples like the integrated circuit represented above. For a more complete understanding of acoustic interactions and analytical convenience different scan modes are provided by PVA TePla Analytical Systems. These are explained here using the example of the integrated circuit. SAM Scanning Modes
A-Scan

A-Scan

A digital waveform on the user interface displays the echoed acoustic signal. This time of flight information corresponds to the depth of the signal coming from the sample. Delaminations or voids cause total reflection and a phase shift in the acoustic wave. The A-scan is used to set one or multiple time gates to select the depth range of view (red line).

B-Scan

B-Scan

The scanner is moved in a desired direction to get a cross section image in either X or Y direction. The depth of different structures within the sample can be measured.

P-Scan

P-Scan

Multiple parallel cross sections (B-Scans) are recorded through the sample. The slices are free selectable.

C-Scan

C-Scan

The scanner is moved in a meander pattern over the sample. The resulting image, composed line by line, represents a cross section in the x, y axis (parallel to the surface). Delaminated areas can be highlighted automatically and are shown here in red.

X-Scan

X-Scan

More than 50 C-Scan images can be displayed from different layers during a single scan in real time. Each image represents the same layer depth. Areas and image depths are freely selectable by the operator.

G-Scan

G-Scan

The G-scan produces multiple C-scan images at defined layer depths and thicknesses. Different settings can be stored for automatic evaluation. If more than one gate is placed (G-Scan), multiple images are acquired simultaneously and displayed on the monitor.

D-Scan

D-Scan

D-scan combines the B-Scan and C-Scan functions to a meander scan. The resulting image represents a diagonal section through the sample.

Z-Scan

Z-Scan

The Z-Scan simulates 3-D imaging of the substrate volume. The Z-Scan enables offline reconstruction of A, B, C, D, P, X, 3-D Scans and time of flight images with free selectable gate windows.

Through-Scan

Through-Scan

A transducer above the samples emits an ultrasonic signal which will be detected by a second transducer placed underneath the sample. In this mode images are collected containing shadows of defects causing strong acoustic reflections. Both transducers can simultaneously probe the sample giving both Through-Scan and C- Scan images.

T-Scan

T-Scan

The T-Scan or tray scan enables automatic evaluation of a series of equispaced and identical specimens in succession. A specimen tray or holder is typically needed.

ROT-Scan

ROT-Scan

A cylindrical sample is inspected by rotating it around its centre axis.

HISA

HISA

HISA dynamically controls the z-axis positioning of the transducer. This function not only keeps the data gate at the interface of interest, it also keeps the interface in focus even for bowed substrates.

V(z)-Scan

V(z)-Scan

V(z)-Scans measure acoustic reflection intensities as a function of the lens position in the z-axis. Intensities graphed versus z-axis position result in V(z) curve plots. From these plots the physical properties of materials can be calculated.

 

 

 

 

© 2007 - 2016 PVA TePla America. All rights reserved.