Microwave Plasma System PS 90

The PS 90 is an extremely compact, high-performance, automatic Single Wafer Asher providing very low cost of ownership. It is designed to serve MEMS-manufacturing as well as main stream semiconductor resist stripping and descum applications in semiconductor device fabrication for wafer sizes up to 300 mm. Unique system characteristics like strong isotropy and high ash rates at moderate substrate temperatures make it a perfect tool for a wide range of wafer cleaning and stripping applications like:

• Resist removal and descum in wafer bumping
• Sacrificial layer removal of photoresist, polyimide, PMMA etc.
• Fast resist ashing after high-dose implant and RIE
• 300 mm wafer reclaim
• Removal of SU-8 epoxy resist
• Silicon nitride etch

The PS 90 is equipped with a unique planar microwave plasma source for utmost uniformity, providing high ash rates over a wide temperature range. In combination with Chemraz-seals, fluorinated process gases can be applied. Also offered is an ATEX-certified Hydrogen gas option with H2-generator, enabling the user to apply Hydrogen as process gas in any concentration. The modular platform allows to configure the system for 200 or 300 mm wafers using open cassette as well as FOUP or SMIF load stations. The wafer chuck with lift pins for loading is thermoelectrically controlled from RT to 250°C.

To Request a Brochure/Literature/Product CD, Click Here