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Technical Specifications:

Wafer sizes:
200 and 300 mm

Plasma Chamber:


Chucking system:
 Wafer chuck with lift pins

Wafer transportation:
 Atmospheric transfer robot
 Loading station for FOUP, SMIF
 or OLP (Open Load Port)

Plasma Generation:
 Unique planar MW source for
 large area uniformity
 Frequency 2.45 GHz
 max. 2000W
 variable Power

System Dimension:
 W x H X D = 850 x 2.000 x 2.060 mm

Weight: 1000 kg

 Additional gas channels 3-4
 Vacuum pump system
 Cooling chuck
 Hydrogen Generator

Related Applications:
  • Photoresist Ashing
  • SU-8 Removal


    Microwave Plasma System GIGAfab A200/300

    The GIGAfab A is a compact, high-performance, automatic Single Wafer Asher. It is designed to serve main stream semiconductor photoresist stripping, esp. hi-dose implanted resist, MEMS-manufacturing and descum applications for wafer sizes up to 300 mm. Strong isotropy and high ash rates at moderate substrate temperatures make it a perfect tool for a wide range of wafer cleaning and stripping applications like:

    • Resist removal and descum in wafer bumping
    • Sacrificial layer removal of photoresist, polyimide, PMMA etc.
    • Fast resist ashing after high-dose implant and RIE
    • 300 mm wafer reclaim
    • Removal of SU-8 epoxy resist

    The GIGAfab A is equipped with a unique planar microwave plasma source, providing high ash rates over a wide temperature range. In combination with Chemraz-seals, fluorinated process gases can be applied. The modular platform allows to configure the system for 200 or 300 mm wafers using open cassette as well as FOUP or SMIF load stations. The wafer chuck with lift pins for loading is thermoelectrically controlled from RT to 250°C. Additional option is an ATEX-certified Hydrogen generator, acting as a point-of-use gas supply.

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