Microwave Plasma Treatment System
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Technical Specifications:

Process Chamber
  Material Aluminum
  Volume 91 liters
  Inner dimensions 450 x 450 x 450 mm
  No RF- electrodes inside chamber

Vacuum System
  Vacuum connection DN 63 ISO K
  Process gas control 2 gas channels standard,
  each with MFC and
  solenoid valve
  Base pressure Approx. 2 x 10-2 mbar
  Process pressure Approx. 0.2–2 mbar
  Evacuation time Approx. 1 minute
  Vacuum gauge Capacitance manometer,
  10-2 to 10 mbar
  Venting Solenoid valve

Plasma Source
  Microwave Generator
  Frequency 2.45 GHz
  Adjustable magnetron, air-cooled,
  proprietary antenna
  and coupling geometry
  Power 0–1.000 W

Performance Data
  Uptime >95%
  MTBF >500 h
  MTTR <2 h

System Control
  Hardware PC based system controller
  10,4" monitor, GUI
  Light Tower system status r/g/y
  Software Realtime Operating System QNX
  Manual and automatic system control
  multiple recipe storage
  Process recipe up to 100 recipes
  with 1-10 steps each
  System selftest routine,
  warnings error message dialog
  Soft- and hardware safety interlocks,
   optical plasma intensity monitoring
   Electricity 230 V, single-phase, 15 A, 50/60 Hz
  Process gas 1/4“ Swagelok connector,
  input pressure 1–2 bar
   Compressed air 1/4“ Swagelok connector,
   input pressure 4–6 bar
  W/H/D Approx. 1.050 x 1.750 x 800 mm
   Weight 195 kg (system only, excluding pump)
  Pumping system Vacuum pump system comprising
   rotary vane pump or combination of
  rotary vane pump and 250 m3/h
   (145 cfm) rootsblower,
   400 V, 3 phase, 32 A max.
   Rotary platform Aluminum, 400 mm Ø
   Gas channels 3–4
  ECR setup

Related Applications:


GIGA 690


Microwave Plasma System GIGA 690   

The Plasma System GIGA 690 is a state-of-the-art plasma processing equipment. It is a PC-controlled production tool, featuring all options of data communication, and moreover, it is the most versatile plasma cleaning system in the world of chip packaging.

Featuring electrode-free energy feeding and plasma generation, the GIGA 690 system delivers unsurpassed flexibility. This electrode-free power coupling is key to the treatment of substrates in closed, non-slotted magazines in the downstream process.

Slotted magazines are processed perfectly on a rotating platform.

In addition, the ECR mode is an extra function of this plasma system.

PVA TePla’s unique microwave plasma processing technology serves a broad spectrum of applications including plasma cleaning before wire bond, mold and solder ball attach, as well as plasma cleaning and activation prior to Flip Chip underfill and undermold. 

Our process capability upgrade, introducing pure H2, is one more decisive benefit. It provides e.g. unparalleled cleaning performance prior to wire bonding by removing oxide layers, sulphur residues or other inorganic impurities (H2 safety certificate available).

As a most modern production tool, the Microwave Plasma System GIGA 690 provides high throughput and serves the full range of chip packaging applications.

The system is featuring a highly attractive graphical user interface and is programmed with an easily mastered operating platform. The Plasma System GIGA 690 is available with a hinged or sliding-type door design. 

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