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Microwave Plasma System 400 H2

 

The Microwave Plasma System 400 H2 is an example from PVA TePla’s 400/660 Series devices, which are the most versatile plasma cleaners in the world of chip packaging.

Our unique microwave plasma process technology serves a broad spectrum of applications including plasma cleaning before wire bonding, mold and FlipChip underfill as well as the cleaning of whole wafers (up to 12").

Featuring electrode-free energy feeding and plasma generation, the 400 and 660 systems, including the Plasma System 400 H2, deliver unsurpassed flexibility, e.g. the treatment of substrates in closed, non-slotted magazines in the downstream process.

Slotted magazines are processed perfectly on a rotating platform, while the ECR function rounds off the operating modes of these systems.

Most important, the Microwave Plasma System 400/660 Series is particularly well suited for mass production, providing high throughput and serving chip packaging applications.

The systems are noted for their highly user-friendly interface and easily mastered operating platform. These systems are available with a hinged or sliding-type door design.

A special feature of the Plasma System 400 H2 is the capability to run pure H2 plasmas. Pure H2 microwave plasma enables unsurpassed cleaning performance prior to wire bonding, particularly in the removal of fluorine residues from wafers and die pads. Sulphur impurities and oxide layers are also cleaned from bond fingers very effectively.

The PVA TePla Plasma System 400 H2 fully complies with the European safety regulation standards (ATEX) and carries the TUEV Germany association official safety certificate.

 


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