«Return to Applications   Details

Microwave Plasma Systems 400

Technical Specifications:

Plasma Chamber:
 W x H x D = 400 x 400 x 400 mm

Plasma Generation:
 MW Frequency 2.45 GHz
 max. 1.000 Watt, variable power

System Dimension:
 W x H x D = approx. 900 x 600 x 760 mm

 150 kg, Table Top Model

 Vacuum Pump System
 Additional gas channels 3-4
 Aluminum rotary platform, 350 mmŲ

Related Applications:

  • Bond Pad Cleaning
  • Flip Chip Underfill
  • Encapsulation

    PS 400

    The Microwave Plasma Systems 400 is the most versatile plasma cleaners in the world of chip packaging. Our unique microwave plasma process technology serves a broad spectrum of applications including plasma cleaning before wire bonding, mold and FlipChip underfill as well as the cleaning of whole wafers (up to 12"). Featuring electrode-free energy feeding and plasma generation, the 400 system delivers unsurpassed flexibility. This electrode-free power coupling is key to the treatment of substrates in closed, non-slotted magazines in the downstream process.

    Slotted magazines are processed perfectly on a rotating platform.

    In addition, the ECR mode is an extra function of these plasma systems.

    Our H2 process capability upgrade (using pure H2) provides unsurpassed cleaning performance prior to wire bonding, e.g. removing fluorine (F2) residues, sulphur (S) impurities or oxide layers, (H2 safety certificate available) and is ideal for oxygen sensitive substrates, such as Cu, N, and Ag .

    The systems are noted for their highly user-friendly interface and easily mastered operating platform. The Plasma System 400 is available with a hinged or sliding-type door design.

    To Request a Brochure/Literature/Product CD, Click Here

    © 2007 - 2016 PVA TePla America. All rights reserved.