Plasma System 300 | PVATePla America, Inc.
   
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GIGABATCH SERIES MICROWAVE PLASMA SYSTEMS

Technical Specifications:

Plasma Chamber:
 Quartz, Diameter 245 mm
 Depth 380 mm

Plasma Generation:
 MW Frequency 2.45 GHz
 max. 1.000 Watt
 variable Power

 

Related Applications:

 

GIGAbatch 310 M GIGAbatch 360 M GIGAbatch A380 P

GIGAbatch Series Microwave Plasma SystemS
Models 310M, 360/380 M, 360/380 P, A 360/380 P

The GIGAbatch series is the latest and most advanced generation of batch ashers offered today and is the successor of the very popular 300 series. Main use is resist removal and wafer cleaning. State-of-the-art process control in combination with microwave plasma generation are the key elements of the GIGAbatch family of products. Starting at very economic prices, the systems range from R&D tools to fully-automatic loaded systems for high-volume production in Waferfabs up to 200mm. Batch systems are readily usable for all wafer sizes and substrate shapes. All models feature the unique drawer door for easy loading without touching the plasma chamber.

The GIGAfab series of single wafer tools complements the product range to serve the more demanding applications for 200 and 300 mm wafers, targeting wafer bumping, high-dose implant strip and low temperature processing.

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